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CMPTH81
20V,50mA,225mW Surface mount Transistor-Small Signal (<=1A) PNP RF Oscillator
CMPTH81 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP681-CMPTH81
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMPTH81 BK Discontinued , Stock Only 20V,50mA,225mW Surface mount Transistor-Small Signal (<=1A) PNP RF Oscillator Box@3,500 None
EAR99 8541.21.0080 C3D or 3D 
Either
PBFREE
TIN/LEAD
CMPTH81 TR Discontinued , Stock Only 20V,50mA,225mW Surface mount Transistor-Small Signal (<=1A) PNP RF Oscillator Reel@3,000 In Stock
EAR99 8541.21.0080 C3D or 3D 
Either
PBFREE
TIN/LEAD
CP681-MPSH81-CM Discontinued , Stock Only 20V,50mA,350mW Bare die,15.000 X 15.000 mils,Transistor-Small Signal (<=1A) WafflePack@400 In Stock
EAR99 8541.21.0040  
CP681-MPSH81-CT Discontinued , Stock Only 20V,50mA,350mW Bare die,15.000 X 15.000 mils,Transistor-Small Signal (<=1A) WafflePack@400 None
EAR99 8541.21.0040  
CP681-MPSH81-CT20 Discontinued , Stock Only 20V,50mA,350mW Bare die,15.000 X 15.000 mils,Transistor-Small Signal (<=1A) WafflePack@20 None
EAR99 8541.21.0040  
CP681-CMPTH81-WN Discontinued, Stock Only 20V,50mA,225mW Bare die,15.000 X 15.000 mils,Transistor-Small Signal (<=1A) Wafer@74,000*</br>*Estimated, die qty will vary based on probing In Stock
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Analytical Test Report:Henkel 84-1LMISR4
Material Composition:SOT-23
Process Change Notice:Copper Wire Bonding
Package Detail Document:SOT-23
Product EOL Notice:CP681 wafer process including
Product Reliability Data:SOT-23 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CP681-CMPTH81
20V,50mA,225mW Bare die,15.000 X 15.000 mils,Transistor-Small Signal (<=1A)
WaferForm, WafflePack
Discontinued, Stock Only

CP681-MPSH81
20V,50mA,350mW Bare die,15.000 X 15.000 mils,Transistor-Small Signal (<=1A)
WaferForm, WafflePack
Discontinued, Stock Only

MPSH81
20V,50mA,350mW Through-Hole Transistor-Small Signal (<=1A) PNP RF Oscillator
Box, Reel
Discontinued, Stock Only

None

 

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