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CMPT3019
80V,500mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN High Current
CMPT3019 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP305-2N3019
Chip Process Datasheet:CP306V-2N3019
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMPT3019 BK Active 80V,500mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN High Current Box@3,500 In Stock
EAR99 8541.21.0080 C3A 
Either
PBFREE
TIN/LEAD
CMPT3019 TR Active 80V,500mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN High Current Reel@3,000 In Stock
EAR99 8541.21.0080 C3A 
Either
PBFREE
TIN/LEAD
CP306V-2N3019-CM Active 80V,1A,800mW Bare die,27.560 X 27.560 mils,Transistor-Small Signal (<=1A) WafflePack@400 Please call for Qty
EAR99 8541.21.0040  
CP306V-2N3019-CT Active 80V,1A,800mW Bare die,27.560 X 27.560 mils,Transistor-Small Signal (<=1A) WafflePack@400 In Stock
EAR99 8541.21.0040  
CP306V-2N3019-WN Active 80V,1A,800mW Bare die,27.560 X 27.560 mils,Transistor-Small Signal (<=1A) Wafer@22,655*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.21.0040  
CP306V-2N3019-WR Active 80V,1A,800mW Bare die,27.560 X 27.560 mils,Transistor-Small Signal (<=1A) Wafer@22,655*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.21.0040  
CP305-2N3019-CT20 Discontinued, Stock Only 80V,1A,800mW Bare die,31.100 X 31.100 mils,Transistor-Small Signal (<=1A) WafflePack@20 In Stock,Replaced by CP306V-2N3019-CT20
Exact Electrical Equivalent, Slight Mechanical Differences
EAR99 8541.21.0040  
CP306V-2N3019-CT20 Special Order Item 80V,1A,800mW Bare die,27.560 X 27.560 mils,Transistor-Small Signal (<=1A) WafflePack@20 In Stock
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Analytical Test Report:Henkel 84-1LMISR4
Spice Model:Spice Model CMPT3019
Material Composition:SOT-23
Process Change Notice:Copper Wire Bonding
Package Detail Document:SOT-23
Product Reliability Data:SOT-23 Package Reliability
Step File 3D Object:SOT-23

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CP305-2N3019
80V,1A,800mW Bare die,31.100 X 31.100 mils,Transistor-Small Signal (<=1A)
WaferForm, WafflePack
Discontinued, Stock Only<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CP306V-2N3019">Replaced by:CP306V-2N3019</a>

CP306V-2N3019
80V,1A,800mW Bare die,27.560 X 27.560 mils,Transistor-Small Signal (<=1A)
WaferForm, WafflePack
Active

CXT3019
80V,1A,1.2W Surface mount Transistor-Small Signal (<=1A) NPN High Current
Box, Reel
Active

CZT3019
80V,1A,2W Surface mount Transistor-Small Signal (<=1A) NPN High Current
Box, Reel
Active

2N3019
80V,1A,800mW Through-Hole Transistor-Small Signal (<=1A) NPN High Current
Box
Active

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