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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

2N7002
115mA,60V Surface mount MOSFET N-Channel Enhancement Mode
2N7002 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
2N7002 BK Active 115mA,60V Surface mount MOSFET N-Channel Enhancement Mode Box@3,500 Please call for Qty
 EAR99 8541.21.0080 702 
Either
PBFREE
TIN/LEAD
2N7002 TR Active 115mA,60V Surface mount MOSFET N-Channel Enhancement Mode Reel@3,000 In Stock
 EAR99 8541.21.0080 702 
Either
PBFREE
TIN/LEAD
2N7002 TR13 Active 115mA,60V Surface mount MOSFET N-Channel Enhancement Mode Reel@10,000 In Stock
 EAR99 8541.21.0080 702 
Either
PBFREE
TIN/LEAD
CP324-2N7002-CM Discontinued 115mA,60V Bare die,21.650 X 21.650 mils,MOSFET WafflePack@400 None
 EAR99 8541.21.0040  
CP324-2N7002-CT Discontinued 115mA,60V Bare die,21.650 X 21.650 mils,MOSFET WafflePack@400 None
 EAR99 8541.21.0040  
CP324-2N7002-WN Discontinued 115mA,60V Bare die,21.650 X 21.650 mils,MOSFET Wafer@33,500*</br>*Estimated, die qty will vary based on probing None
 EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Analytical Test Report:Henkel 84-1LMISR4
Spice Model:Spice Model 2N7002
Material Composition:SOT-23
Process Change Notice:Copper Wire Bonding
Package Detail Document:SOT-23
Product Reliability Data:SOT-23 Package Reliability
Step File 3D Object:SOT-23

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CP324-2N7002 		115mA,60V Bare die,21.650 X 21.650 mils,MOSFET
WaferForm, WafflePack
Discontinued, Stock Only

None

 

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